| Architecture Introduction |
2003 |
2000 |
| Infrastructure |
Socket 754, lidless uPGA |
Socket 478, FC-PGA2 |
| Process Technology |
0.13 Micron, SOI |
0.13 Micron |
| Number of Transistors |
105.9 Million |
55 Million |
| 64-bit Instruction Set Support |
Yes,
AMD64 technology |
No |
| 32-bit Instruction Set Support |
Yes |
Yes |
| System Bus Technology |
HyperTransportTM technology up to 1600MHz
Full duplex |
533MHz Front Side Bus
Half duplex |
| Integrated DDR Memory Controller (MCT) |
Yes,
64-bit + 8-bit ECC
PC 3200, PC 2700, PC 2100, or PC1600 SO-DIMMs |
No,
Discrete logic device on motherboard |
| Processor-to-System Bandwidth |
HyperTransport: up to 6.4 GB/s
Memory controller: up to 3.2 GB/s
Total: up to 9.6 GB/s |
Total: up to 4.3 GB/s |
| Integrated Northbridge |
Yes,
128-bit data path @ CPU core frequency |
No,
Discrete logic device on motherboard,
64-bit data path @ 133MHz |
| High-Performance, On-Chip Cache |
L1: 128KB
L2: 1024KB (exclusive)
Total Effective Cache: 1152KB |
L1: 12K µop trace + 8KB data
L2: 512KB (Inclusive)
Total Effective Cache: 512KB |
| Advanced Power Management |
AMD PowerNow!TM technology |
Enhanced Intel Speedstep® technology |
| Wireless Compatibility |
802.11 a, b and g |
802.11 a, b and g |
| 3D and Multimedia Instructions |
3DNow!TM Professional technology, SSE2 |
SSE, SSE2 |
